ASE Commits NT$123.7 Billion to AI-Driven Semiconductor Expansion

On 6 November, ASE Semiconductor announced planned investment of NT$123.7 billion (approximately US$3.74 billion) in advanced chip packaging and testing facilities in Kaohsiung and Tainan. The expansion will introduce AI, big-data analytics and automated production equipment to improve efficiency and manufacturing yields. The project creates opportunities in AI infrastructure, semiconductor technology and industrial automation. HPC can support digital transformation, technology assessments and strategic partnerships.

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